Enable QMI TMD support #149
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Add a new generic driver for thermal cooling devices that control remote processors (modem, DSP, etc.) through various communication channels. This driver provides an abstraction layer between the thermal subsystem and vendor-specific remote processor communication mechanisms. Suggested-by: Amit Kucheria <amit.kucheria@oss.qualcomm.com> Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com> Link: https://lore.kernel.org/r/20251223123227.1317244-2-gaurav.kohli@oss.qualcomm.com
The cooling subnode of a remoteproc represents a client of the Thermal Mitigation Device QMI service running on it. Each subnode of the cooling node represents a single control exposed by the service. Add maintainer name also and update this binding for cdsp substem. Co-developed-by: Casey Connolly <casey.connolly@linaro.org> Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com> Signed-off-by: Casey Connolly <casey.connolly@linaro.org> Link: https://lore.kernel.org/r/20251223123227.1317244-4-gaurav.kohli@oss.qualcomm.com
The Thermal Mitigation Device (TMD) service exposes various platform specific thermal mitigations available on remote subsystems (ie the modem and cdsp). The service is exposed via the QMI messaging interface, usually over the QRTR transport. Qualcomm QMI-based TMD cooling devices are used to mitigate thermal conditions across multiple remote subsystems. These devices operate based on junction temperature sensors (TSENS) associated with thermal zones for each subsystem. Co-developed-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com> Signed-off-by: Casey Connolly <casey.connolly@linaro.org> Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com> Link: https://lore.kernel.org/r/20251223123227.1317244-5-gaurav.kohli@oss.qualcomm.com
Generalise the qcom,bam-dmux child node support by probing all remoteproc children with of_platform_populate(). This will be used to enable support for devices which are best represented as subnodes of the remoteproc, such as those representing QMI clients. Signed-off-by: Casey Connolly <casey.connolly@linaro.org> Link: https://lore.kernel.org/r/20251223123227.1317244-3-gaurav.kohli@oss.qualcomm.com
Enable cdsp cooling devices and thermal zone cooling map bindings for both cdsp and cdsp1. Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com> Link: https://lore.kernel.org/r/20251223123227.1317244-6-gaurav.kohli@oss.qualcomm.com
Enable cdsp cooling devices and thermal zone cooling map bindings for cdsp. Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
Enable cdsp cooling devices and cooling map bindings for cdsp. Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com> Link: https://lore.kernel.org/r/20251223123227.1317244-8-gaurav.kohli@oss.qualcomm.com
Enable cdsp cooling devices and thermal zone cooling map bindings for cdsp. Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com> Link: https://lore.kernel.org/r/20251223123227.1317244-7-gaurav.kohli@oss.qualcomm.com
Enable Remoteproc cooling feature config. Signed-off-by: Gaurav Kohli <gaurav.kohli@oss.qualcomm.com>
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Enable Remote Proc subsystem cooling support.
CRs-Fixed: 3719815